Liftoff process compatible vacuum deposition equipment
This is a dedicated deposition device designed for the lift process commonly used in high-frequency communication devices.
The "Lift-off Process Compatible Vacuum Deposition System" is a dedicated deposition device designed for the lift-off process, widely used in optical devices and high-frequency communication devices such as compound semiconductors and SAW devices. Equipped with an electron gun and resistance heating electrodes as evaporation sources, it enables the formation of thick films, including high-melting-point electrode films and precious metals. It excels in the verticality of the incident angle of evaporated particles onto the substrate, and low-temperature deposition is possible due to various mechanisms that prevent temperature rise of the substrate during film formation (substrate water cooling mechanism, reflective electron trap for the electron gun, radiation light prevention measures). **Features** - Verticality of the incident angle of deposition particles onto the substrate (90°±3° at 6-inch wafers) - Low-temperature deposition (below 70°C = proven value) due to the substrate water cooling mechanism - High-speed exhaust with a large-diameter exhaust system and clean background for dense film quality - Flexible hard and soft compatibility with a rich variety of options (single wafer type = CtoC conversion, load lock conversion, composite process = load lock conversion + bonding with other process chambers) - A demo unit is permanently available for sample testing. *For more details, please refer to the PDF document or feel free to contact us.*
- Company：神港精機 東京支店
- Price：Other
